Infrared Hot Air Reflow Oven Market Research, Help Manufacturing Upgrade
Posted By: Yan | Published Date: Nov 20,2023
Demand for consumer electronics has led to a surge in printed circuit board assembly, and the infrared hot air reflow oven industry is heating up. According to LP Information Data, the global market was valued at nearly $300 million in 2020 and is expected to grow at a CAGR of 4% through 2024.
Reflow ovens are at the heart of PCB manufacturing, relying on precise thermal profiles to economically fuse large numbers of tiny surface-mount components onto circuit boards during assembly. The advantage of infrared technology is that it directly heats the component without overcooking the surrounding material, resulting in higher yields.
Unsurprisingly, consumers of reflow ovens are concentrated in the Asian manufacturing centres of China, Japan and Taiwan, where industry clusters are numerous. China dominates with a 35% market share, with major contract manufacturers producing millions of smartphones and laptops each year on highly automated SMT lines.
Today, large reflow oven manufacturers Baoding Tianwei Electric and Heller dominate, but face new competition from ambitious regional players in Southeast Asia and India. In addition, German automotive supplier Dürr and Japanese heavyweight Heller are enjoying great success in exporting modular mid-range systems designed for prototyping or low-volume industrial applications outside the consumer sector.
Customers seek the flexibility of different form factors and fast transfer times to increase throughput. As a result, multi-zone processing, conveyor integration and advanced sensors enabling automated in-situ defect detection have become the norm. Industry experts anticipate increased R&D around tighter temperature control of fine-pitch components, mass airflow modelling to optimise energy use and compatibility with next-generation lead-free alloys.
With consumer spending power on the rise in developing countries and the industrialisation of 5G/IoT infrastructure in its early stages, the long-term outlook remains positive if OEMs continue to ensure that reflow soldering units meet the efficiency and throughput needs of high-mix, low-volume markets in the areas of automated diagnostics or renewable energy, for example, energy, unlocking predictive maintenance use cases through modular scalability and software advances. As circular economy principles reshape global supply chains, adaptable solutions appear to promise profitability.
Learn more : LP Information Data（ Infrared Hot Air Reflow Oven Industry ）
Reflow ovens are at the heart of PCB manufacturing, relying on precise thermal profiles to economically fuse large numbers of tiny surface-mount components onto circuit boards during assembly. The advantage of infrared technology is that it directly heats the component without overcooking the surrounding material, resulting in higher yields.
Unsurprisingly, consumers of reflow ovens are concentrated in the Asian manufacturing centres of China, Japan and Taiwan, where industry clusters are numerous. China dominates with a 35% market share, with major contract manufacturers producing millions of smartphones and laptops each year on highly automated SMT lines.
Today, large reflow oven manufacturers Baoding Tianwei Electric and Heller dominate, but face new competition from ambitious regional players in Southeast Asia and India. In addition, German automotive supplier Dürr and Japanese heavyweight Heller are enjoying great success in exporting modular mid-range systems designed for prototyping or low-volume industrial applications outside the consumer sector.
Customers seek the flexibility of different form factors and fast transfer times to increase throughput. As a result, multi-zone processing, conveyor integration and advanced sensors enabling automated in-situ defect detection have become the norm. Industry experts anticipate increased R&D around tighter temperature control of fine-pitch components, mass airflow modelling to optimise energy use and compatibility with next-generation lead-free alloys.
With consumer spending power on the rise in developing countries and the industrialisation of 5G/IoT infrastructure in its early stages, the long-term outlook remains positive if OEMs continue to ensure that reflow soldering units meet the efficiency and throughput needs of high-mix, low-volume markets in the areas of automated diagnostics or renewable energy, for example, energy, unlocking predictive maintenance use cases through modular scalability and software advances. As circular economy principles reshape global supply chains, adaptable solutions appear to promise profitability.
Learn more : LP Information Data（ Infrared Hot Air Reflow Oven Industry ）