Global Molded Interconnect Substrate (MIS) Market Growth 2024-2030--LP INFORMATION, INC.

Global Molded Interconnect Substrate (MIS) Market Growth 2024-2030

Product Code: 1170931

Industry: Electronics & Semiconductor

Published: Oct 27,2024

Pages: 94

Delivery Time: 2-3 business days

Global Molded Interconnect Substrate (MIS) Market Growth 2024-2030

Product Code: 1170931

Industry: Electronics & Semiconductor

Published: Oct 27,2024

Pages: 94

Delivery Time: 2-3 business days

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Description

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.

The global Molded Interconnect Substrate (MIS) market size is projected to grow from US$ 591 million in 2024 to US$ 1248 million in 2030; it is expected to grow at a CAGR of 13.3% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Molded Interconnect Substrate (MIS) Industry Forecast” looks at past sales and reviews total world Molded Interconnect Substrate (MIS) sales in 2023, providing a comprehensive analysis by region and market sector of projected Molded Interconnect Substrate (MIS) sales for 2024 through 2030. With Molded Interconnect Substrate (MIS) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Molded Interconnect Substrate (MIS) industry.

This Insight Report provides a comprehensive analysis of the global Molded Interconnect Substrate (MIS) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Molded Interconnect Substrate (MIS) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Molded Interconnect Substrate (MIS) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Molded Interconnect Substrate (MIS) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Molded Interconnect Substrate (MIS).

MIS (Molded Interconnect Substrate) substrates, as a new packaging technology, have been gaining momentum in the market in recent years.

At present, there are many suppliers in the MIS substrate market, including ASE, Carsem, JCET, Unisem, etc. These companies are actively developing IC packaging technology based on MIS substrates and are competing fiercely in the market.

Market development trend

Technology continues to improve: With the further improvement of integrated circuit product performance and the demand for ultra-thin products, MIS substrate technology is also constantly improving. For example, by optimizing wiring design, increasing wiring density, and adopting more advanced electroplating copper pillar technology, MIS substrates have shown significant advantages in electrical, thermal performance and reliability.

Continuous expansion of application areas: In addition to traditional analog chips, power ICs and digital currency fields, MIS substrates have also been widely used in the packaging of RF and power management devices in electronic products such as mobile phones, industrial control, and IOT. In the future, as electronic products continue to develop in the direction of high performance, multi-function, and high-frequency transmission, the application areas of MIS substrates will be further expanded.

Accelerated domestic substitution: In the field of mid- and low-end packaging, traditional lead frame packaging is gradually replaced by IC substrates. As a type of IC substrate, MIS substrates are expected to play an important role in the process of domestic substitution with their superior performance and cost-effectiveness.

This report presents a comprehensive overview, market shares, and growth opportunities of Molded Interconnect Substrate (MIS) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Single Layer

    Multilayer

Segmentation by Application:

    Analog Chip

    Power IC

    Digital Currency

    Others

This report also splits the market by region:

    Americas

    United States

    Canada

    Mexico

    Brazil

    APAC

    China

    Japan

    Korea

    Southeast Asia

    India

    Australia

    Europe

    Germany

    France

UK

    Italy

    Russia

    Middle East & Africa

    Egypt

    South Africa

    Israel

    Turkey

    GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

    ASM Advanced Packaging Materials

    Unisem

    Phoenix Pioneer Technology

    ASE Material

    Carsem

    JCET Group

    MISpak

    Advanpack

Key Questions Addressed in this Report

What is the 10-year outlook for the global Molded Interconnect Substrate (MIS) market?

What factors are driving Molded Interconnect Substrate (MIS) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Molded Interconnect Substrate (MIS) market opportunities vary by end market size?

How does Molded Interconnect Substrate (MIS) break out by Type, by Application?

Table Of Contents

1 Scope of the Report
    1.1 Market Introduction
    1.2 Years Considered
    1.3 Research Objectives
    1.4 Market Research Methodology
    1.5 Research Process and Data Source
    1.6 Economic Indicators
    1.7 Currency Considered
    1.8 Market Estimation Caveats

2 Executive Summary
    2.1 World Market Overview
        2.1.1 Global Molded Interconnect Substrate (MIS) Annual Sales 2019-2030
        2.1.2 World Current & Future Analysis for Molded Interconnect Substrate (MIS) by Geographic Region, 2019, 2023 & 2030
        2.1.3 World Current & Future Analysis for Molded Interconnect Substrate (MIS) by Country/Region, 2019, 2023 & 2030
    2.2 Molded Interconnect Substrate (MIS) Segment by Type
        2.2.1 Single Layer
        2.2.2 Multilayer
    2.3 Molded Interconnect Substrate (MIS) Sales by Type
        2.3.1 Global Molded Interconnect Substrate (MIS) Sales Market Share by Type (2019-2024)
        2.3.2 Global Molded Interconnect Substrate (MIS) Revenue and Market Share by Type (2019-2024)
        2.3.3 Global Molded Interconnect Substrate (MIS) Sale Price by Type (2019-2024)
    2.4 Molded Interconnect Substrate (MIS) Segment by Application
        2.4.1 Analog Chip
        2.4.2 Power IC
        2.4.3 Digital Currency
        2.4.4 Others
    2.5 Molded Interconnect Substrate (MIS) Sales by Application
        2.5.1 Global Molded Interconnect Substrate (MIS) Sale Market Share by Application (2019-2024)
        2.5.2 Global Molded Interconnect Substrate (MIS) Revenue and Market Share by Application (2019-2024)
        2.5.3 Global Molded Interconnect Substrate (MIS) Sale Price by Application (2019-2024)

3 Global by Company
    3.1 Global Molded Interconnect Substrate (MIS) Breakdown Data by Company
        3.1.1 Global Molded Interconnect Substrate (MIS) Annual Sales by Company (2019-2024)
        3.1.2 Global Molded Interconnect Substrate (MIS) Sales Market Share by Company (2019-2024)
    3.2 Global Molded Interconnect Substrate (MIS) Annual Revenue by Company (2019-2024)
        3.2.1 Global Molded Interconnect Substrate (MIS) Revenue by Company (2019-2024)
        3.2.2 Global Molded Interconnect Substrate (MIS) Revenue Market Share by Company (2019-2024)
    3.3 Global Molded Interconnect Substrate (MIS) Sale Price by Company
    3.4 Key Manufacturers Molded Interconnect Substrate (MIS) Producing Area Distribution, Sales Area, Product Type
        3.4.1 Key Manufacturers Molded Interconnect Substrate (MIS) Product Location Distribution
        3.4.2 Players Molded Interconnect Substrate (MIS) Products Offered
    3.5 Market Concentration Rate Analysis
        3.5.1 Competition Landscape Analysis
        3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
    3.6 New Products and Potential Entrants
    3.7 Market M&A Activity & Strategy

4 World Historic Review for Molded Interconnect Substrate (MIS) by Geographic Region
    4.1 World Historic Molded Interconnect Substrate (MIS) Market Size by Geographic Region (2019-2024)
        4.1.1 Global Molded Interconnect Substrate (MIS) Annual Sales by Geographic Region (2019-2024)
        4.1.2 Global Molded Interconnect Substrate (MIS) Annual Revenue by Geographic Region (2019-2024)
    4.2 World Historic Molded Interconnect Substrate (MIS) Market Size by Country/Region (2019-2024)
        4.2.1 Global Molded Interconnect Substrate (MIS) Annual Sales by Country/Region (2019-2024)
        4.2.2 Global Molded Interconnect Substrate (MIS) Annual Revenue by Country/Region (2019-2024)
    4.3 Americas Molded Interconnect Substrate (MIS) Sales Growth
    4.4 APAC Molded Interconnect Substrate (MIS) Sales Growth
    4.5 Europe Molded Interconnect Substrate (MIS) Sales Growth
    4.6 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Growth

5 Americas
    5.1 Americas Molded Interconnect Substrate (MIS) Sales by Country
        5.1.1 Americas Molded Interconnect Substrate (MIS) Sales by Country (2019-2024)
        5.1.2 Americas Molded Interconnect Substrate (MIS) Revenue by Country (2019-2024)
    5.2 Americas Molded Interconnect Substrate (MIS) Sales by Type (2019-2024)
    5.3 Americas Molded Interconnect Substrate (MIS) Sales by Application (2019-2024)
    5.4 United States
    5.5 Canada
    5.6 Mexico
    5.7 Brazil

6 APAC
    6.1 APAC Molded Interconnect Substrate (MIS) Sales by Region
        6.1.1 APAC Molded Interconnect Substrate (MIS) Sales by Region (2019-2024)
        6.1.2 APAC Molded Interconnect Substrate (MIS) Revenue by Region (2019-2024)
    6.2 APAC Molded Interconnect Substrate (MIS) Sales by Type (2019-2024)
    6.3 APAC Molded Interconnect Substrate (MIS) Sales by Application (2019-2024)
    6.4 China
    6.5 Japan
    6.6 South Korea
    6.7 Southeast Asia
    6.8 India
    6.9 Australia
    6.10 China Taiwan

7 Europe
    7.1 Europe Molded Interconnect Substrate (MIS) by Country
        7.1.1 Europe Molded Interconnect Substrate (MIS) Sales by Country (2019-2024)
        7.1.2 Europe Molded Interconnect Substrate (MIS) Revenue by Country (2019-2024)
    7.2 Europe Molded Interconnect Substrate (MIS) Sales by Type (2019-2024)
    7.3 Europe Molded Interconnect Substrate (MIS) Sales by Application (2019-2024)
    7.4 Germany
    7.5 France
    7.6 UK
    7.7 Italy
    7.8 Russia

8 Middle East & Africa
    8.1 Middle East & Africa Molded Interconnect Substrate (MIS) by Country
        8.1.1 Middle East & Africa Molded Interconnect Substrate (MIS) Sales by Country (2019-2024)
        8.1.2 Middle East & Africa Molded Interconnect Substrate (MIS) Revenue by Country (2019-2024)
    8.2 Middle East & Africa Molded Interconnect Substrate (MIS) Sales by Type (2019-2024)
    8.3 Middle East & Africa Molded Interconnect Substrate (MIS) Sales by Application (2019-2024)
    8.4 Egypt
    8.5 South Africa
    8.6 Israel
    8.7 Turkey
    8.8 GCC Countries

9 Market Drivers, Challenges and Trends
    9.1 Market Drivers & Growth Opportunities
    9.2 Market Challenges & Risks
    9.3 Industry Trends

10 Manufacturing Cost Structure Analysis
    10.1 Raw Material and Suppliers
    10.2 Manufacturing Cost Structure Analysis of Molded Interconnect Substrate (MIS)
    10.3 Manufacturing Process Analysis of Molded Interconnect Substrate (MIS)
    10.4 Industry Chain Structure of Molded Interconnect Substrate (MIS)

11 Marketing, Distributors and Customer
    11.1 Sales Channel
        11.1.1 Direct Channels
        11.1.2 Indirect Channels
    11.2 Molded Interconnect Substrate (MIS) Distributors
    11.3 Molded Interconnect Substrate (MIS) Customer

12 World Forecast Review for Molded Interconnect Substrate (MIS) by Geographic Region
    12.1 Global Molded Interconnect Substrate (MIS) Market Size Forecast by Region
        12.1.1 Global Molded Interconnect Substrate (MIS) Forecast by Region (2025-2030)
        12.1.2 Global Molded Interconnect Substrate (MIS) Annual Revenue Forecast by Region (2025-2030)
    12.2 Americas Forecast by Country (2025-2030)
    12.3 APAC Forecast by Region (2025-2030)
    12.4 Europe Forecast by Country (2025-2030)
    12.5 Middle East & Africa Forecast by Country (2025-2030)
    12.6 Global Molded Interconnect Substrate (MIS) Forecast by Type (2025-2030)
    12.7 Global Molded Interconnect Substrate (MIS) Forecast by Application (2025-2030)

13 Key Players Analysis
    13.1 ASM Advanced Packaging Materials
        13.1.1 ASM Advanced Packaging Materials Company Information
        13.1.2 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.1.3 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.1.4 ASM Advanced Packaging Materials Main Business Overview
        13.1.5 ASM Advanced Packaging Materials Latest Developments
    13.2 Unisem
        13.2.1 Unisem Company Information
        13.2.2 Unisem Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.2.3 Unisem Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.2.4 Unisem Main Business Overview
        13.2.5 Unisem Latest Developments
    13.3 Phoenix Pioneer Technology
        13.3.1 Phoenix Pioneer Technology Company Information
        13.3.2 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.3.3 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.3.4 Phoenix Pioneer Technology Main Business Overview
        13.3.5 Phoenix Pioneer Technology Latest Developments
    13.4 ASE Material
        13.4.1 ASE Material Company Information
        13.4.2 ASE Material Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.4.3 ASE Material Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.4.4 ASE Material Main Business Overview
        13.4.5 ASE Material Latest Developments
    13.5 Carsem
        13.5.1 Carsem Company Information
        13.5.2 Carsem Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.5.3 Carsem Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.5.4 Carsem Main Business Overview
        13.5.5 Carsem Latest Developments
    13.6 JCET Group
        13.6.1 JCET Group Company Information
        13.6.2 JCET Group Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.6.3 JCET Group Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.6.4 JCET Group Main Business Overview
        13.6.5 JCET Group Latest Developments
    13.7 MISpak
        13.7.1 MISpak Company Information
        13.7.2 MISpak Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.7.3 MISpak Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.7.4 MISpak Main Business Overview
        13.7.5 MISpak Latest Developments
    13.8 Advanpack
        13.8.1 Advanpack Company Information
        13.8.2 Advanpack Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
        13.8.3 Advanpack Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2019-2024)
        13.8.4 Advanpack Main Business Overview
        13.8.5 Advanpack Latest Developments

14 Research Findings and Conclusion

List Of Tables

List of Tables
 Table 1. Molded Interconnect Substrate (MIS) Annual Sales CAGR by Geographic Region (2019, 2023 & 2030) & ($ millions)
 Table 2. Molded Interconnect Substrate (MIS) Annual Sales CAGR by Country/Region (2019, 2023 & 2030) & ($ millions)
 Table 3. Major Players of Single Layer
 Table 4. Major Players of Multilayer
 Table 5. Global Molded Interconnect Substrate (MIS) Sales by Type (2019-2024) & (K Pcs)
 Table 6. Global Molded Interconnect Substrate (MIS) Sales Market Share by Type (2019-2024)
 Table 7. Global Molded Interconnect Substrate (MIS) Revenue by Type (2019-2024) & ($ million)
 Table 8. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Type (2019-2024)
 Table 9. Global Molded Interconnect Substrate (MIS) Sale Price by Type (2019-2024) & (US$/Pcs)
 Table 10. Global Molded Interconnect Substrate (MIS) Sale by Application (2019-2024) & (K Pcs)
 Table 11. Global Molded Interconnect Substrate (MIS) Sale Market Share by Application (2019-2024)
 Table 12. Global Molded Interconnect Substrate (MIS) Revenue by Application (2019-2024) & ($ million)
 Table 13. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Application (2019-2024)
 Table 14. Global Molded Interconnect Substrate (MIS) Sale Price by Application (2019-2024) & (US$/Pcs)
 Table 15. Global Molded Interconnect Substrate (MIS) Sales by Company (2019-2024) & (K Pcs)
 Table 16. Global Molded Interconnect Substrate (MIS) Sales Market Share by Company (2019-2024)
 Table 17. Global Molded Interconnect Substrate (MIS) Revenue by Company (2019-2024) & ($ millions)
 Table 18. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Company (2019-2024)
 Table 19. Global Molded Interconnect Substrate (MIS) Sale Price by Company (2019-2024) & (US$/Pcs)
 Table 20. Key Manufacturers Molded Interconnect Substrate (MIS) Producing Area Distribution and Sales Area
 Table 21. Players Molded Interconnect Substrate (MIS) Products Offered
 Table 22. Molded Interconnect Substrate (MIS) Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
 Table 23. New Products and Potential Entrants
 Table 24. Market M&A Activity & Strategy
 Table 25. Global Molded Interconnect Substrate (MIS) Sales by Geographic Region (2019-2024) & (K Pcs)
 Table 26. Global Molded Interconnect Substrate (MIS) Sales Market Share Geographic Region (2019-2024)
 Table 27. Global Molded Interconnect Substrate (MIS) Revenue by Geographic Region (2019-2024) & ($ millions)
 Table 28. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Geographic Region (2019-2024)
 Table 29. Global Molded Interconnect Substrate (MIS) Sales by Country/Region (2019-2024) & (K Pcs)
 Table 30. Global Molded Interconnect Substrate (MIS) Sales Market Share by Country/Region (2019-2024)
 Table 31. Global Molded Interconnect Substrate (MIS) Revenue by Country/Region (2019-2024) & ($ millions)
 Table 32. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Country/Region (2019-2024)
 Table 33. Americas Molded Interconnect Substrate (MIS) Sales by Country (2019-2024) & (K Pcs)
 Table 34. Americas Molded Interconnect Substrate (MIS) Sales Market Share by Country (2019-2024)
 Table 35. Americas Molded Interconnect Substrate (MIS) Revenue by Country (2019-2024) & ($ millions)
 Table 36. Americas Molded Interconnect Substrate (MIS) Sales by Type (2019-2024) & (K Pcs)
 Table 37. Americas Molded Interconnect Substrate (MIS) Sales by Application (2019-2024) & (K Pcs)
 Table 38. APAC Molded Interconnect Substrate (MIS) Sales by Region (2019-2024) & (K Pcs)
 Table 39. APAC Molded Interconnect Substrate (MIS) Sales Market Share by Region (2019-2024)
 Table 40. APAC Molded Interconnect Substrate (MIS) Revenue by Region (2019-2024) & ($ millions)
 Table 41. APAC Molded Interconnect Substrate (MIS) Sales by Type (2019-2024) & (K Pcs)
 Table 42. APAC Molded Interconnect Substrate (MIS) Sales by Application (2019-2024) & (K Pcs)
 Table 43. Europe Molded Interconnect Substrate (MIS) Sales by Country (2019-2024) & (K Pcs)
 Table 44. Europe Molded Interconnect Substrate (MIS) Revenue by Country (2019-2024) & ($ millions)
 Table 45. Europe Molded Interconnect Substrate (MIS) Sales by Type (2019-2024) & (K Pcs)
 Table 46. Europe Molded Interconnect Substrate (MIS) Sales by Application (2019-2024) & (K Pcs)
 Table 47. Middle East & Africa Molded Interconnect Substrate (MIS) Sales by Country (2019-2024) & (K Pcs)
 Table 48. Middle East & Africa Molded Interconnect Substrate (MIS) Revenue Market Share by Country (2019-2024)
 Table 49. Middle East & Africa Molded Interconnect Substrate (MIS) Sales by Type (2019-2024) & (K Pcs)
 Table 50. Middle East & Africa Molded Interconnect Substrate (MIS) Sales by Application (2019-2024) & (K Pcs)
 Table 51. Key Market Drivers & Growth Opportunities of Molded Interconnect Substrate (MIS)
 Table 52. Key Market Challenges & Risks of Molded Interconnect Substrate (MIS)
 Table 53. Key Industry Trends of Molded Interconnect Substrate (MIS)
 Table 54. Molded Interconnect Substrate (MIS) Raw Material
 Table 55. Key Suppliers of Raw Materials
 Table 56. Molded Interconnect Substrate (MIS) Distributors List
 Table 57. Molded Interconnect Substrate (MIS) Customer List
 Table 58. Global Molded Interconnect Substrate (MIS) Sales Forecast by Region (2025-2030) & (K Pcs)
 Table 59. Global Molded Interconnect Substrate (MIS) Revenue Forecast by Region (2025-2030) & ($ millions)
 Table 60. Americas Molded Interconnect Substrate (MIS) Sales Forecast by Country (2025-2030) & (K Pcs)
 Table 61. Americas Molded Interconnect Substrate (MIS) Annual Revenue Forecast by Country (2025-2030) & ($ millions)
 Table 62. APAC Molded Interconnect Substrate (MIS) Sales Forecast by Region (2025-2030) & (K Pcs)
 Table 63. APAC Molded Interconnect Substrate (MIS) Annual Revenue Forecast by Region (2025-2030) & ($ millions)
 Table 64. Europe Molded Interconnect Substrate (MIS) Sales Forecast by Country (2025-2030) & (K Pcs)
 Table 65. Europe Molded Interconnect Substrate (MIS) Revenue Forecast by Country (2025-2030) & ($ millions)
 Table 66. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Forecast by Country (2025-2030) & (K Pcs)
 Table 67. Middle East & Africa Molded Interconnect Substrate (MIS) Revenue Forecast by Country (2025-2030) & ($ millions)
 Table 68. Global Molded Interconnect Substrate (MIS) Sales Forecast by Type (2025-2030) & (K Pcs)
 Table 69. Global Molded Interconnect Substrate (MIS) Revenue Forecast by Type (2025-2030) & ($ millions)
 Table 70. Global Molded Interconnect Substrate (MIS) Sales Forecast by Application (2025-2030) & (K Pcs)
 Table 71. Global Molded Interconnect Substrate (MIS) Revenue Forecast by Application (2025-2030) & ($ millions)
 Table 72. ASM Advanced Packaging Materials Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 73. ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 74. ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 75. ASM Advanced Packaging Materials Main Business
 Table 76. ASM Advanced Packaging Materials Latest Developments
 Table 77. Unisem Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 78. Unisem Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 79. Unisem Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 80. Unisem Main Business
 Table 81. Unisem Latest Developments
 Table 82. Phoenix Pioneer Technology Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 83. Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 84. Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 85. Phoenix Pioneer Technology Main Business
 Table 86. Phoenix Pioneer Technology Latest Developments
 Table 87. ASE Material Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 88. ASE Material Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 89. ASE Material Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 90. ASE Material Main Business
 Table 91. ASE Material Latest Developments
 Table 92. Carsem Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 93. Carsem Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 94. Carsem Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 95. Carsem Main Business
 Table 96. Carsem Latest Developments
 Table 97. JCET Group Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 98. JCET Group Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 99. JCET Group Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 100. JCET Group Main Business
 Table 101. JCET Group Latest Developments
 Table 102. MISpak Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 103. MISpak Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 104. MISpak Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 105. MISpak Main Business
 Table 106. MISpak Latest Developments
 Table 107. Advanpack Basic Information, Molded Interconnect Substrate (MIS) Manufacturing Base, Sales Area and Its Competitors
 Table 108. Advanpack Molded Interconnect Substrate (MIS) Product Portfolios and Specifications
 Table 109. Advanpack Molded Interconnect Substrate (MIS) Sales (K Pcs), Revenue ($ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 110. Advanpack Main Business
 Table 111. Advanpack Latest Developments


List of Figures
 Figure 1. Picture of Molded Interconnect Substrate (MIS)
 Figure 2. Molded Interconnect Substrate (MIS) Report Years Considered
 Figure 3. Research Objectives
 Figure 4. Research Methodology
 Figure 5. Research Process and Data Source
 Figure 6. Global Molded Interconnect Substrate (MIS) Sales Growth Rate 2019-2030 (K Pcs)
 Figure 7. Global Molded Interconnect Substrate (MIS) Revenue Growth Rate 2019-2030 ($ millions)
 Figure 8. Molded Interconnect Substrate (MIS) Sales by Geographic Region (2019, 2023 & 2030) & ($ millions)
 Figure 9. Molded Interconnect Substrate (MIS) Sales Market Share by Country/Region (2023)
 Figure 10. Molded Interconnect Substrate (MIS) Sales Market Share by Country/Region (2019, 2023 & 2030)
 Figure 11. Product Picture of Single Layer
 Figure 12. Product Picture of Multilayer
 Figure 13. Global Molded Interconnect Substrate (MIS) Sales Market Share by Type in 2023
 Figure 14. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Type (2019-2024)
 Figure 15. Molded Interconnect Substrate (MIS) Consumed in Analog Chip
 Figure 16. Global Molded Interconnect Substrate (MIS) Market: Analog Chip (2019-2024) & (K Pcs)
 Figure 17. Molded Interconnect Substrate (MIS) Consumed in Power IC
 Figure 18. Global Molded Interconnect Substrate (MIS) Market: Power IC (2019-2024) & (K Pcs)
 Figure 19. Molded Interconnect Substrate (MIS) Consumed in Digital Currency
 Figure 20. Global Molded Interconnect Substrate (MIS) Market: Digital Currency (2019-2024) & (K Pcs)
 Figure 21. Molded Interconnect Substrate (MIS) Consumed in Others
 Figure 22. Global Molded Interconnect Substrate (MIS) Market: Others (2019-2024) & (K Pcs)
 Figure 23. Global Molded Interconnect Substrate (MIS) Sale Market Share by Application (2023)
 Figure 24. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Application in 2023
 Figure 25. Molded Interconnect Substrate (MIS) Sales by Company in 2023 (K Pcs)
 Figure 26. Global Molded Interconnect Substrate (MIS) Sales Market Share by Company in 2023
 Figure 27. Molded Interconnect Substrate (MIS) Revenue by Company in 2023 ($ millions)
 Figure 28. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Company in 2023
 Figure 29. Global Molded Interconnect Substrate (MIS) Sales Market Share by Geographic Region (2019-2024)
 Figure 30. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Geographic Region in 2023
 Figure 31. Americas Molded Interconnect Substrate (MIS) Sales 2019-2024 (K Pcs)
 Figure 32. Americas Molded Interconnect Substrate (MIS) Revenue 2019-2024 ($ millions)
 Figure 33. APAC Molded Interconnect Substrate (MIS) Sales 2019-2024 (K Pcs)
 Figure 34. APAC Molded Interconnect Substrate (MIS) Revenue 2019-2024 ($ millions)
 Figure 35. Europe Molded Interconnect Substrate (MIS) Sales 2019-2024 (K Pcs)
 Figure 36. Europe Molded Interconnect Substrate (MIS) Revenue 2019-2024 ($ millions)
 Figure 37. Middle East & Africa Molded Interconnect Substrate (MIS) Sales 2019-2024 (K Pcs)
 Figure 38. Middle East & Africa Molded Interconnect Substrate (MIS) Revenue 2019-2024 ($ millions)
 Figure 39. Americas Molded Interconnect Substrate (MIS) Sales Market Share by Country in 2023
 Figure 40. Americas Molded Interconnect Substrate (MIS) Revenue Market Share by Country (2019-2024)
 Figure 41. Americas Molded Interconnect Substrate (MIS) Sales Market Share by Type (2019-2024)
 Figure 42. Americas Molded Interconnect Substrate (MIS) Sales Market Share by Application (2019-2024)
 Figure 43. United States Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 44. Canada Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 45. Mexico Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 46. Brazil Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 47. APAC Molded Interconnect Substrate (MIS) Sales Market Share by Region in 2023
 Figure 48. APAC Molded Interconnect Substrate (MIS) Revenue Market Share by Region (2019-2024)
 Figure 49. APAC Molded Interconnect Substrate (MIS) Sales Market Share by Type (2019-2024)
 Figure 50. APAC Molded Interconnect Substrate (MIS) Sales Market Share by Application (2019-2024)
 Figure 51. China Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 52. Japan Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 53. South Korea Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 54. Southeast Asia Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 55. India Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 56. Australia Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 57. China Taiwan Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 58. Europe Molded Interconnect Substrate (MIS) Sales Market Share by Country in 2023
 Figure 59. Europe Molded Interconnect Substrate (MIS) Revenue Market Share by Country (2019-2024)
 Figure 60. Europe Molded Interconnect Substrate (MIS) Sales Market Share by Type (2019-2024)
 Figure 61. Europe Molded Interconnect Substrate (MIS) Sales Market Share by Application (2019-2024)
 Figure 62. Germany Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 63. France Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 64. UK Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 65. Italy Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 66. Russia Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 67. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Market Share by Country (2019-2024)
 Figure 68. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Market Share by Type (2019-2024)
 Figure 69. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Market Share by Application (2019-2024)
 Figure 70. Egypt Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 71. South Africa Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 72. Israel Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 73. Turkey Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 74. GCC Countries Molded Interconnect Substrate (MIS) Revenue Growth 2019-2024 ($ millions)
 Figure 75. Manufacturing Cost Structure Analysis of Molded Interconnect Substrate (MIS) in 2023
 Figure 76. Manufacturing Process Analysis of Molded Interconnect Substrate (MIS)
 Figure 77. Industry Chain Structure of Molded Interconnect Substrate (MIS)
 Figure 78. Channels of Distribution
 Figure 79. Global Molded Interconnect Substrate (MIS) Sales Market Forecast by Region (2025-2030)
 Figure 80. Global Molded Interconnect Substrate (MIS) Revenue Market Share Forecast by Region (2025-2030)
 Figure 81. Global Molded Interconnect Substrate (MIS) Sales Market Share Forecast by Type (2025-2030)
 Figure 82. Global Molded Interconnect Substrate (MIS) Revenue Market Share Forecast by Type (2025-2030)
 Figure 83. Global Molded Interconnect Substrate (MIS) Sales Market Share Forecast by Application (2025-2030)
 Figure 84. Global Molded Interconnect Substrate (MIS) Revenue Market Share Forecast by Application (2025-2030)

Companies Mentioned

ASM Advanced Packaging Materials

Unisem

Phoenix Pioneer Technology

ASE Material

Carsem

JCET Group

MISpak

Advanpack

Methodology

LP Information presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

Data Sourse

Primary Source

Secondary Source

Players/Suppliers

Journals and Periodicals

Industry Experts

Government Bodies

Distributors/Traders

Annual Reports

Opinion Leaders

Presentations

Front-line Staff