Global Molding Equipment for Wafer and Panel Level Packaging Market Growth 2025-2031

Product Code: 1751480

Industry: Electronics & Semiconductor

Published: Nov 26,2025

Pages: 102

Delivery Time: 2-3 business days

Global Molding Equipment for Wafer and Panel Level Packaging Market Growth 2025-2031

Product Code: 1751480

Industry: Electronics & Semiconductor

Published: Nov 26,2025

Pages: 102

Delivery Time: 2-3 business days

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Description

The global Molding Equipment for Wafer and Panel Level Packaging market size is predicted to grow from US$ 397 million in 2025 to US$ 612 million in 2031; it is expected to grow at a CAGR of 7.5% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

In 2024, global Molding Equipment for Wafer and Panel Level Packaging production reached approximately 387 units, with an average global market price of around US$ 974,250 per unit.

Molding Equipment for Wafer and Panel Level Packaging is core semiconductor advanced packaging equipment used for encapsulating wafers or large-size panels. It applies molding compounds (epoxy resins, etc.) to the surface of wafers/panels through precision molding processes such as transfer molding or compression molding, forming a uniform protective layer that integrates multiple chips. Featuring high molding precision, excellent encapsulation uniformity, and compatibility with large-size substrates, it effectively protects chips from environmental interference, enhances mechanical stability and electrical performance, and is critical for realizing heterogeneous integration and 3D stacking in advanced packaging technologies (e.g., fan-out wafer/panel level packaging).

The single-line production capacity of Molding Equipment for Wafer and Panel Level Packaging is 39 to 42 units per year, the average gross profit margin was 45.2%.

The cost structure of Molding Equipment for Wafer and Panel Level Packaging is dominated by four core components with clear weights: core component costs account for the largest share at 45%-55%, mainly including precision molding modules, high-precision motion control systems, temperature/pressure control units, and die-casting mechanisms, where the accuracy and stability of core components directly determine the equipment's process capability and cost level. R&D and certification costs make up 25%-30%, dedicated to optimizing molding process parameters, improving compatibility with large-size panels and special molding compounds, and meeting SEMI semiconductor industry standards, as high technological barriers and strict reliability verification are key to market entry. Production and assembly costs represent 15%-20%, covering precision machining, system integration, and long-term stability testing—high-precision assembly and process calibration for large-size substrates increase manufacturing complexity. Packaging and logistics costs constitute the remaining 5%-8%, including shockproof packaging, professional transportation, and on-site installation and commissioning services, with high requirements for equipment transportation safety and technical support.

The industry chain of Molding Equipment for Wafer and Panel Level Packaging consists of three interconnected tiers: upstream includes suppliers of core components (motion control systems, precision molds, temperature/pressure sensors), raw materials (epoxy molding compounds), precision mechanical parts, and electronic components, as well as providers of process software and testing instruments. Midstream involves enterprises engaged in product design, core component integration, system assembly, and performance calibration, focusing on adjusting equipment specifications and process parameters to adapt to different wafer/panel sizes and advanced packaging process requirements (e.g., 3D stacking, heterogeneous integration). Downstream covers semiconductor wafer fabs, advanced packaging and testing enterprises (OSAT), and IDM manufacturers, with demand driven by the upgrading of semiconductor advanced packaging technologies and the expansion of applications in high-performance computing, AI, and automotive electronics.

Demand for Molding Equipment for Wafer and Panel Level Packaging is growing rapidly driven by the global expansion of advanced packaging markets, the widespread adoption of wafer/panel level packaging technologies, and the surge in demand for high-performance chips in AI, 5G, and intelligent driving. It addresses pain points such as low efficiency and poor uniformity of traditional packaging equipment in large-size substrate processing, while the accelerated domestic substitution trend in semiconductor equipment provides broad market space. Key business opportunities lie in developing high-precision equipment for large-size panel level packaging to meet mass production needs, optimizing compatibility with third-generation semiconductor materials and new molding compounds, and expanding into emerging semiconductor manufacturing hubs. Additionally, strengthening independent R&D of core technologies to break foreign monopolies and collaborating with downstream enterprises for customized process solutions can further tap into the high-growth potential of the advanced packaging equipment market.

LP Information, Inc. (LPI) ' newest research report, the “Molding Equipment for Wafer and Panel Level Packaging Industry Forecast” looks at past sales and reviews total world Molding Equipment for Wafer and Panel Level Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Molding Equipment for Wafer and Panel Level Packaging sales for 2025 through 2031. With Molding Equipment for Wafer and Panel Level Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Molding Equipment for Wafer and Panel Level Packaging industry.

This Insight Report provides a comprehensive analysis of the global Molding Equipment for Wafer and Panel Level Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Molding Equipment for Wafer and Panel Level Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Molding Equipment for Wafer and Panel Level Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Molding Equipment for Wafer and Panel Level Packaging and breaks down the forecast by Molding Method, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Molding Equipment for Wafer and Panel Level Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Molding Equipment for Wafer and Panel Level Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Molding Method:
    Compression Molding
    Transfer Molding
    Injection Molding
    Vacuum-Assisted Molding

Segmentation by Substrate Format:
    Wafer-Level Molding (200 Mm / 300 Mm)
    Panel-Level Molding (Large Panel / Fan-Out Panel)
    Strip-Level Molding

Segmentation by Automation Level:
    Semi-Automatic Molding System
    Fully Automatic Molding System

Segmentation by Application:
    Semiconductor Packaging
    Advanced Packaging For Mobile And Consumer Electronics
    Automotive And Industrial Electronics
    High-Reliability And IoT Devices

This report also splits the market by region:
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

    Towa
    Besi
    ASMPT
    APIC YAMADA (Yamaha Robotics)
    Shanghai Xinsheng
    Tongling Trinity Technology
    I-PEX
    Kitakami Techno

Key Questions Addressed in this Report
What is the 10-year outlook for the global Molding Equipment for Wafer and Panel Level Packaging market?
What factors are driving Molding Equipment for Wafer and Panel Level Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Molding Equipment for Wafer and Panel Level Packaging market opportunities vary by end market size?
How does Molding Equipment for Wafer and Panel Level Packaging break out by Molding Method, by Application?

List Of Tables

List of Tables
 Table 1. Molding Equipment for Wafer and Panel Level Packaging Annual Sales CAGR by Geographic Region (2020, 2024 & 2031) & ($ millions)
 Table 2. Molding Equipment for Wafer and Panel Level Packaging Annual Sales CAGR by Country/Region (2020, 2024 & 2031) & ($ millions)
 Table 3. Major Players of Compression Molding
 Table 4. Major Players of Transfer Molding
 Table 5. Major Players of Injection Molding
 Table 6. Major Players of Vacuum-Assisted Molding
 Table 7. Global Molding Equipment for Wafer and Panel Level Packaging Sales by Molding Method (2020-2025) & (Units)
 Table 8. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Molding Method (2020-2025)
 Table 9. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Molding Method (2020-2025) & ($ million)
 Table 10. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Molding Method (2020-2025)
 Table 11. Global Molding Equipment for Wafer and Panel Level Packaging Sale Price by Molding Method (2020-2025) & (US$/Unit)
 Table 12. Major Players of Wafer-Level Molding (200 Mm / 300 Mm)
 Table 13. Major Players of Panel-Level Molding (Large Panel / Fan-Out Panel)
 Table 14. Major Players of Strip-Level Molding
 Table 15. Global Molding Equipment for Wafer and Panel Level Packaging Sales by Substrate Format (2020-2025) & (Units)
 Table 16. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Substrate Format (2020-2025)
 Table 17. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Substrate Format (2020-2025) & ($ million)
 Table 18. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Substrate Format (2020-2025)
 Table 19. Global Molding Equipment for Wafer and Panel Level Packaging Sale Price by Substrate Format (2020-2025) & (US$/Unit)
 Table 20. Major Players of Semi-Automatic Molding System
 Table 21. Major Players of Fully Automatic Molding System
 Table 22. Global Molding Equipment for Wafer and Panel Level Packaging Sales by Automation Level (2020-2025) & (Units)
 Table 23. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Automation Level (2020-2025)
 Table 24. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Automation Level (2020-2025) & ($ million)
 Table 25. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Automation Level (2020-2025)
 Table 26. Global Molding Equipment for Wafer and Panel Level Packaging Sale Price by Automation Level (2020-2025) & (US$/Unit)
 Table 27. Global Molding Equipment for Wafer and Panel Level Packaging Sale by Application (2020-2025) & (Units)
 Table 28. Global Molding Equipment for Wafer and Panel Level Packaging Sale Market Share by Application (2020-2025)
 Table 29. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Application (2020-2025) & ($ million)
 Table 30. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Application (2020-2025)
 Table 31. Global Molding Equipment for Wafer and Panel Level Packaging Sale Price by Application (2020-2025) & (US$/Unit)
 Table 32. Global Molding Equipment for Wafer and Panel Level Packaging Sales by Company (2020-2025) & (Units)
 Table 33. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Company (2020-2025)
 Table 34. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Company (2020-2025) & ($ millions)
 Table 35. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Company (2020-2025)
 Table 36. Global Molding Equipment for Wafer and Panel Level Packaging Sale Price by Company (2020-2025) & (US$/Unit)
 Table 37. Key Manufacturers Molding Equipment for Wafer and Panel Level Packaging Producing Area Distribution and Sales Area
 Table 38. Players Molding Equipment for Wafer and Panel Level Packaging Products Offered
 Table 39. Molding Equipment for Wafer and Panel Level Packaging Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
 Table 40. New Products and Potential Entrants
 Table 41. Market M&A Activity & Strategy
 Table 42. Global Molding Equipment for Wafer and Panel Level Packaging Sales by Geographic Region (2020-2025) & (Units)
 Table 43. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share Geographic Region (2020-2025)
 Table 44. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Geographic Region (2020-2025) & ($ millions)
 Table 45. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Geographic Region (2020-2025)
 Table 46. Global Molding Equipment for Wafer and Panel Level Packaging Sales by Country/Region (2020-2025) & (Units)
 Table 47. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country/Region (2020-2025)
 Table 48. Global Molding Equipment for Wafer and Panel Level Packaging Revenue by Country/Region (2020-2025) & ($ millions)
 Table 49. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Country/Region (2020-2025)
 Table 50. Americas Molding Equipment for Wafer and Panel Level Packaging Sales by Country (2020-2025) & (Units)
 Table 51. Americas Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country (2020-2025)
 Table 52. Americas Molding Equipment for Wafer and Panel Level Packaging Revenue by Country (2020-2025) & ($ millions)
 Table 53. Americas Molding Equipment for Wafer and Panel Level Packaging Sales by Molding Method (2020-2025) & (Units)
 Table 54. Americas Molding Equipment for Wafer and Panel Level Packaging Sales by Application (2020-2025) & (Units)
 Table 55. APAC Molding Equipment for Wafer and Panel Level Packaging Sales by Region (2020-2025) & (Units)
 Table 56. APAC Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Region (2020-2025)
 Table 57. APAC Molding Equipment for Wafer and Panel Level Packaging Revenue by Region (2020-2025) & ($ millions)
 Table 58. APAC Molding Equipment for Wafer and Panel Level Packaging Sales by Molding Method (2020-2025) & (Units)
 Table 59. APAC Molding Equipment for Wafer and Panel Level Packaging Sales by Application (2020-2025) & (Units)
 Table 60. Europe Molding Equipment for Wafer and Panel Level Packaging Sales by Country (2020-2025) & (Units)
 Table 61. Europe Molding Equipment for Wafer and Panel Level Packaging Revenue by Country (2020-2025) & ($ millions)
 Table 62. Europe Molding Equipment for Wafer and Panel Level Packaging Sales by Molding Method (2020-2025) & (Units)
 Table 63. Europe Molding Equipment for Wafer and Panel Level Packaging Sales by Application (2020-2025) & (Units)
 Table 64. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales by Country (2020-2025) & (Units)
 Table 65. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Country (2020-2025)
 Table 66. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales by Molding Method (2020-2025) & (Units)
 Table 67. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales by Application (2020-2025) & (Units)
 Table 68. Key Market Drivers & Growth Opportunities of Molding Equipment for Wafer and Panel Level Packaging
 Table 69. Key Market Challenges & Risks of Molding Equipment for Wafer and Panel Level Packaging
 Table 70. Key Industry Trends of Molding Equipment for Wafer and Panel Level Packaging
 Table 71. Molding Equipment for Wafer and Panel Level Packaging Raw Material
 Table 72. Key Suppliers of Raw Materials
 Table 73. Molding Equipment for Wafer and Panel Level Packaging Distributors List
 Table 74. Molding Equipment for Wafer and Panel Level Packaging Customer List
 Table 75. Global Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Region (2026-2031) & (Units)
 Table 76. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Forecast by Region (2026-2031) & ($ millions)
 Table 77. Americas Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Country (2026-2031) & (Units)
 Table 78. Americas Molding Equipment for Wafer and Panel Level Packaging Annual Revenue Forecast by Country (2026-2031) & ($ millions)
 Table 79. APAC Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Region (2026-2031) & (Units)
 Table 80. APAC Molding Equipment for Wafer and Panel Level Packaging Annual Revenue Forecast by Region (2026-2031) & ($ millions)
 Table 81. Europe Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Country (2026-2031) & (Units)
 Table 82. Europe Molding Equipment for Wafer and Panel Level Packaging Revenue Forecast by Country (2026-2031) & ($ millions)
 Table 83. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Country (2026-2031) & (Units)
 Table 84. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Revenue Forecast by Country (2026-2031) & ($ millions)
 Table 85. Global Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Molding Method (2026-2031) & (Units)
 Table 86. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Forecast by Molding Method (2026-2031) & ($ millions)
 Table 87. Global Molding Equipment for Wafer and Panel Level Packaging Sales Forecast by Application (2026-2031) & (Units)
 Table 88. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Forecast by Application (2026-2031) & ($ millions)
 Table 89. Towa Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 90. Towa Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 91. Towa Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 92. Towa Main Business
 Table 93. Towa Latest Developments
 Table 94. Besi Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 95. Besi Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 96. Besi Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 97. Besi Main Business
 Table 98. Besi Latest Developments
 Table 99. ASMPT Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 100. ASMPT Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 101. ASMPT Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 102. ASMPT Main Business
 Table 103. ASMPT Latest Developments
 Table 104. APIC YAMADA (Yamaha Robotics) Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 105. APIC YAMADA (Yamaha Robotics) Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 106. APIC YAMADA (Yamaha Robotics) Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 107. APIC YAMADA (Yamaha Robotics) Main Business
 Table 108. APIC YAMADA (Yamaha Robotics) Latest Developments
 Table 109. Shanghai Xinsheng Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 110. Shanghai Xinsheng Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 111. Shanghai Xinsheng Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 112. Shanghai Xinsheng Main Business
 Table 113. Shanghai Xinsheng Latest Developments
 Table 114. Tongling Trinity Technology Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 115. Tongling Trinity Technology Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 116. Tongling Trinity Technology Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 117. Tongling Trinity Technology Main Business
 Table 118. Tongling Trinity Technology Latest Developments
 Table 119. I-PEX Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 120. I-PEX Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 121. I-PEX Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 122. I-PEX Main Business
 Table 123. I-PEX Latest Developments
 Table 124. Kitakami Techno Basic Information, Molding Equipment for Wafer and Panel Level Packaging Manufacturing Base, Sales Area and Its Competitors
 Table 125. Kitakami Techno Molding Equipment for Wafer and Panel Level Packaging Product Portfolios and Specifications
 Table 126. Kitakami Techno Molding Equipment for Wafer and Panel Level Packaging Sales (Units), Revenue ($ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 127. Kitakami Techno Main Business
 Table 128. Kitakami Techno Latest Developments


List of Figures
 Figure 1. Picture of Molding Equipment for Wafer and Panel Level Packaging
 Figure 2. Molding Equipment for Wafer and Panel Level Packaging Report Years Considered
 Figure 3. Research Objectives
 Figure 4. Research Methodology
 Figure 5. Research Process and Data Source
 Figure 6. Global Molding Equipment for Wafer and Panel Level Packaging Sales Growth Rate 2020-2031 (Units)
 Figure 7. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Growth Rate 2020-2031 ($ millions)
 Figure 8. Molding Equipment for Wafer and Panel Level Packaging Sales by Geographic Region (2020, 2024 & 2031) & ($ millions)
 Figure 9. Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country/Region (2024)
 Figure 10. Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country/Region (2020, 2024 & 2031)
 Figure 11. Product Picture of Compression Molding
 Figure 12. Product Picture of Transfer Molding
 Figure 13. Product Picture of Injection Molding
 Figure 14. Product Picture of Vacuum-Assisted Molding
 Figure 15. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Molding Method in 2025
 Figure 16. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Molding Method (2020-2025)
 Figure 17. Product Picture of Wafer-Level Molding (200 Mm / 300 Mm)
 Figure 18. Product Picture of Panel-Level Molding (Large Panel / Fan-Out Panel)
 Figure 19. Product Picture of Strip-Level Molding
 Figure 20. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Substrate Format in 2025
 Figure 21. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Substrate Format (2020-2025)
 Figure 22. Product Picture of Semi-Automatic Molding System
 Figure 23. Product Picture of Fully Automatic Molding System
 Figure 24. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Automation Level in 2025
 Figure 25. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Automation Level (2020-2025)
 Figure 26. Molding Equipment for Wafer and Panel Level Packaging Consumed in Semiconductor Packaging
 Figure 27. Global Molding Equipment for Wafer and Panel Level Packaging Market: Semiconductor Packaging (2020-2025) & (Units)
 Figure 28. Molding Equipment for Wafer and Panel Level Packaging Consumed in Advanced Packaging For Mobile And Consumer Electronics
 Figure 29. Global Molding Equipment for Wafer and Panel Level Packaging Market: Advanced Packaging For Mobile And Consumer Electronics (2020-2025) & (Units)
 Figure 30. Molding Equipment for Wafer and Panel Level Packaging Consumed in Automotive And Industrial Electronics
 Figure 31. Global Molding Equipment for Wafer and Panel Level Packaging Market: Automotive And Industrial Electronics (2020-2025) & (Units)
 Figure 32. Molding Equipment for Wafer and Panel Level Packaging Consumed in High-Reliability And IoT Devices
 Figure 33. Global Molding Equipment for Wafer and Panel Level Packaging Market: High-Reliability And IoT Devices (2020-2025) & (Units)
 Figure 34. Global Molding Equipment for Wafer and Panel Level Packaging Sale Market Share by Application (2024)
 Figure 35. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Application in 2025
 Figure 36. Molding Equipment for Wafer and Panel Level Packaging Sales by Company in 2025 (Units)
 Figure 37. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Company in 2025
 Figure 38. Molding Equipment for Wafer and Panel Level Packaging Revenue by Company in 2025 ($ millions)
 Figure 39. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Company in 2025
 Figure 40. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Geographic Region (2020-2025)
 Figure 41. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Geographic Region in 2025
 Figure 42. Americas Molding Equipment for Wafer and Panel Level Packaging Sales 2020-2025 (Units)
 Figure 43. Americas Molding Equipment for Wafer and Panel Level Packaging Revenue 2020-2025 ($ millions)
 Figure 44. APAC Molding Equipment for Wafer and Panel Level Packaging Sales 2020-2025 (Units)
 Figure 45. APAC Molding Equipment for Wafer and Panel Level Packaging Revenue 2020-2025 ($ millions)
 Figure 46. Europe Molding Equipment for Wafer and Panel Level Packaging Sales 2020-2025 (Units)
 Figure 47. Europe Molding Equipment for Wafer and Panel Level Packaging Revenue 2020-2025 ($ millions)
 Figure 48. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales 2020-2025 (Units)
 Figure 49. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Revenue 2020-2025 ($ millions)
 Figure 50. Americas Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country in 2025
 Figure 51. Americas Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Country (2020-2025)
 Figure 52. Americas Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Molding Method (2020-2025)
 Figure 53. Americas Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Application (2020-2025)
 Figure 54. United States Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 55. Canada Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 56. Mexico Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 57. Brazil Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 58. APAC Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Region in 2025
 Figure 59. APAC Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Region (2020-2025)
 Figure 60. APAC Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Molding Method (2020-2025)
 Figure 61. APAC Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Application (2020-2025)
 Figure 62. China Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 63. Japan Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 64. South Korea Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 65. Southeast Asia Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 66. India Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 67. Australia Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 68. China Taiwan Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 69. Europe Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country in 2025
 Figure 70. Europe Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share by Country (2020-2025)
 Figure 71. Europe Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Molding Method (2020-2025)
 Figure 72. Europe Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Application (2020-2025)
 Figure 73. Germany Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 74. France Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 75. UK Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 76. Italy Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 77. Russia Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 78. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Country (2020-2025)
 Figure 79. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Molding Method (2020-2025)
 Figure 80. Middle East & Africa Molding Equipment for Wafer and Panel Level Packaging Sales Market Share by Application (2020-2025)
 Figure 81. Egypt Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 82. South Africa Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 83. Israel Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 84. Turkey Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 85. GCC Countries Molding Equipment for Wafer and Panel Level Packaging Revenue Growth 2020-2025 ($ millions)
 Figure 86. Manufacturing Cost Structure Analysis of Molding Equipment for Wafer and Panel Level Packaging in 2025
 Figure 87. Manufacturing Process Analysis of Molding Equipment for Wafer and Panel Level Packaging
 Figure 88. Industry Chain Structure of Molding Equipment for Wafer and Panel Level Packaging
 Figure 89. Channels of Distribution
 Figure 90. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Forecast by Region (2026-2031)
 Figure 91. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share Forecast by Region (2026-2031)
 Figure 92. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share Forecast by Molding Method (2026-2031)
 Figure 93. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share Forecast by Molding Method (2026-2031)
 Figure 94. Global Molding Equipment for Wafer and Panel Level Packaging Sales Market Share Forecast by Application (2026-2031)
 Figure 95. Global Molding Equipment for Wafer and Panel Level Packaging Revenue Market Share Forecast by Application (2026-2031)

Companies Mentioned

Towa

Besi

ASMPT

APIC YAMADA (Yamaha Robotics)

Shanghai Xinsheng

Tongling Trinity Technology

I-PEX

Kitakami Techno

Methodology

LP Information presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

Data Sourse

Primary Source

Secondary Source

Players/Suppliers

Journals and Periodicals

Industry Experts

Government Bodies

Distributors/Traders

Annual Reports

Opinion Leaders

Presentations

Front-line Staff