Global IC Advanced Packaging Equipment Market Growth 2022-2028

Global IC Advanced Packaging Equipment Market Growth 2022-2028

Product Code:183473

Published Date: Jan 04,2022

Pages: 115

Region: Global

Category: Machinery & Equipment

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As the global economy mends, the 2021 growth of IC Advanced Packaging Equipment will have significant change from previous year. According to our (LP Information) latest study, the global IC Advanced Packaging Equipment market size is USD  million in 2022 from USD 6510.5 million in 2021, with a change of % between 2021 and 2022. The global IC Advanced Packaging Equipment market size will reach USD 12160 million in 2028, growing at a CAGR of 9.3% over the analysis period.

The United States IC Advanced Packaging Equipment market is expected at value of US$  million in 2021 and grow at approximately  % CAGR during review period. China constitutes a  % market for the global IC Advanced Packaging Equipment market, reaching US$  million by the year 2028. As for the Europe IC Advanced Packaging Equipment landscape, Germany is projected to reach US$  million by 2028 trailing a CAGR of  % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at  % and  % respectively for the next 5-year period.

Global main IC Advanced Packaging Equipment players cover ASM Pacific, Applied Material, Advantest, and Kulicke&Soffa, etc. In terms of revenue, the global largest two companies occupy a share nearly  % in 2021.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Advanced Packaging Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
    Cutting Equipment
    Solid Crystal Devices
    Welding Equipment
    Testing Equipment
    Other

Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
    Automotive Electronics
    Consumer Electronics
    Other

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
    ASM Pacific
    Applied Material
    Advantest
    Kulicke&Soffa
    DISCO
    Tokyo Seimitsu
    BESI
    Hitachi
    Teradyne
    Hanmi
    Toray Engineering
    Shinkawa
    COHU Semiconductor
    TOWA
    SUSS Microtec