Global Hard Chemical-Mechanical Polishing (CMP) Pad Market Growth 2023-2029

Global Hard Chemical-Mechanical Polishing (CMP) Pad Market Growth 2023-2029

Product Code:461520

Published Date: Feb 08,2023

Pages: 99

Region: Global

Category: Electronics & Semiconductor

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CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes. CMP Pad can be divided Hard CMP Pad and Soft CMP Pad. As for Hard CMP Pad, its base material is polyurethane.

LPI (LP Information)' newest research report, the “Hard Chemical-Mechanical Polishing (CMP) Pad Industry Forecast” looks at past sales and reviews total world Hard Chemical-Mechanical Polishing (CMP) Pad sales in 2022, providing a comprehensive analysis by region and market sector of projected Hard Chemical-Mechanical Polishing (CMP) Pad sales for 2023 through 2029. With Hard Chemical-Mechanical Polishing (CMP) Pad sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hard Chemical-Mechanical Polishing (CMP) Pad industry.

This Insight Report provides a comprehensive analysis of the global Hard Chemical-Mechanical Polishing (CMP) Pad landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Hard Chemical-Mechanical Polishing (CMP) Pad portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Hard Chemical-Mechanical Polishing (CMP) Pad market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hard Chemical-Mechanical Polishing (CMP) Pad and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hard Chemical-Mechanical Polishing (CMP) Pad.

The global Hard Chemical-Mechanical Polishing (CMP) Pad market size is projected to grow from US$ 660.3 million in 2022 to US$ 859.5 million in 2029; it is expected to grow at a CAGR of 859.5 from 2023 to 2029.

Hard Chemical-Mechanical Polishing (CMP) Pad market has several key players, like DuPont, FUJIBO, and CMC Materials with market share 95.01% in value. Global giant manufactures mainly distributed in USA, Japan and Taiwan. It has unshakable status in this field.

China Taiwan is the largest consumption region of hard CMP Pads, with a consumption market share nearly 22.00% in 2019. The second place is South Korea; following China Taiwan with the consumption market share over 21.38% in 2019.

This report presents a comprehensive overview, market shares, and growth opportunities of Hard Chemical-Mechanical Polishing (CMP) Pad market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:
Segmentation by type
    Polyurethane CMP Pads
    Other Materials

Segmentation by application
    300mm Wafer
    200mm Wafer
    Others

This report also splits the market by region:
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
    DuPont
    CMC Materials, Inc.
    FOJIBO
    TWI Incorporated
    Hubei Dinglong Co.,Ltd
    FNS TECH Co., LTD
    3M
    SKC
    IV Technologies Co., Ltd.

Key Questions Addressed in this Report
What is the 10-year outlook for the global Hard Chemical-Mechanical Polishing (CMP) Pad market?
What factors are driving Hard Chemical-Mechanical Polishing (CMP) Pad market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Hard Chemical-Mechanical Polishing (CMP) Pad market opportunities vary by end market size?
How does Hard Chemical-Mechanical Polishing (CMP) Pad break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?