Global Temporary Bonding Adhesive Market Growth 2023-2029

Global Temporary Bonding Adhesive Market Growth 2023-2029

Product Code:462703

Published Date: Feb 08,2023

Pages: 94

Region: Global

Category: Electronics & Semiconductor

PDF DOWNLOAD

GET FREE SAMPLE

CUSTOMIZE REQUEST

PDF DOWNLOAD

GET FREE SAMPLE

CUSTOMIZE REQUEST

SELECT A FORMAT

ADD TO BASKET

BUY NOW

Provide comprehensive and accurate analysis and reports according to your exact requirements

Provide comprehensive and accurate analysis and reports according to your exact requirements

CONTACT US

Temporary bonding adhesive can bonded with different surface, This product can be used for backside processes such as fixing, thinning, etching, passivation, electroplating, and reflow soldering of thin wafers below 100μm.

LPI (LP Information)' newest research report, the “Temporary Bonding Adhesive Industry Forecast” looks at past sales and reviews total world Temporary Bonding Adhesive sales in 2022, providing a comprehensive analysis by region and market sector of projected Temporary Bonding Adhesive sales for 2023 through 2029. With Temporary Bonding Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Temporary Bonding Adhesive industry.

This Insight Report provides a comprehensive analysis of the global Temporary Bonding Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Temporary Bonding Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Temporary Bonding Adhesive market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Temporary Bonding Adhesive and breaks down the forecast by debonding method, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Temporary Bonding Adhesive.

The global Temporary Bonding Adhesive market size is projected to grow from US$ 191.6 million in 2022 to US$ 339.4 million in 2029; it is expected to grow at a CAGR of 339.4 from 2023 to 2029.

Global key players of temporary bonding adhesive include 3M, Daxin Materials, etc. Global top 3 companies hold a share over 40%. Asia Pacific is the largest market, with a share over 70%, followed by Europe and North America with the share about 15% and 10%. In terms of product, thermal slide-off debonding is the largest segment, with a share over 50%. And in terms of application, the largest application is MEMS, with a share about 40%.

This report presents a comprehensive overview, market shares, and growth opportunities of Temporary Bonding Adhesive market by product debonding method, application, key manufacturers and key regions and countries.

Market Segmentation:
Segmentation by debonding method
    Thermal Slide-off Debonding
    Mechanical Debonding
    Laser Debonding

Segmentation by application
    MEMS
    Advanced Packaging
    CMOS
    Others

This report also splits the market by region:
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
    3M
    Daxin Materials
    Brewer Science
    AI Technology
    YINCAE Advanced Materials
    Micro Materials
    Promerus
    Daetec

Key Questions Addressed in this Report
What is the 10-year outlook for the global Temporary Bonding Adhesive market?
What factors are driving Temporary Bonding Adhesive market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Temporary Bonding Adhesive market opportunities vary by end market size?
How does Temporary Bonding Adhesive break out debonding method, application?
What are the influences of COVID-19 and Russia-Ukraine war?